Tushar Chauhan, Package Design Engineer, Senior Staff, Marvell Technology
Bichen Chen, Hardware Engineer, Apple
Yuan Chen, Sr. Electrical Engineer, Microsoft
Asmita Dani, RFIC Design Engineer, Sonera Magnetics
Benjamin Dannan, Chief Technologist, Signal Edge Solutions
Michael Derrenbacher, Design Verification Engineer, Texas Instruments
Sukanta Dey, Senior EDA Tools Software Engineer, Intel
Josh Diedrich, Software Design Engineer, Tektronix
Qian Ding, Packaging R&D Engineer, Intel
Yuandong Guo, SI Engineer, Cruise
Chang Hsien, Principle Electrical Engineer, Dell EMC
Di Hu, Sr. Manager, Electrical Engineering, Cruise
Yifan Huang, Sr. Signal and Power Integrity Manager, AMD
Licheng (Joshua), Hardware Systems Engineer, NXP Semiconductors
Bonnie Lam, Sr. Electrical Engineer, Microsoft
Chaofeng Li, PhD Student, EMC Lab, Missouri University of Science and Technology
Jun Liao, Principle Engineer, Intel
Sinan Liu, Signal & Power Integrity Engineer, Meta
Wei Liu, Signal & Power Integrity Engineer, Intel
Abishek Manian, Analog Design Manager & Senior Member of Technical Staff, Texas Instruments
Shubhankar Marathe, Sr. ESD System Design Engineer, Amazon Lab126
Christian Naumann, Signal Integrity Engineer/ Power Engineer, Cisco Systems
Scotty Neally, PMTS Analog Design Engineer, AMD
Deepak Pai, RF Desense Engineer, Meta Platforms
Justin Patterson, DSP Software Engineer, Tektronix
Guilherme Paulino, System Engineer, Lumentum
Kyle Sammon, Staff System Architect, TE Connectivity
Greylan Smoak, Signal Integrity Engineer, Samtec
Tim Wang Lee, Signal Integrity Application Scientist, Keysight Technologies
Tao Wang, Sr. EMC Engineer, Amazon
Scott Witcher, Signal/Power Integrity Engineer, Chipletz
Yang Xu, EMC Engineer, Cruise
Ming Yang, Systems Engineer, Alphawave SEMI/University of Toronto
Guanshun Yu, Staff ASIC Design Engineer, Qualcomm