Tushar Chauhan, Package Design Engineer, Senior Staff, Marvell Technology

Bichen Chen, Hardware Engineer, Apple

Yuan Chen, Sr. Electrical Engineer, Microsoft

Asmita Dani, RFIC Design Engineer, Sonera Magnetics

Benjamin Dannan, Chief Technologist, Signal Edge Solutions

Michael Derrenbacher, Design Verification Engineer, Texas Instruments

Sukanta Dey, Senior EDA Tools Software Engineer, Intel 

Josh Diedrich, Software Design Engineer, Tektronix

Qian Ding, Packaging R&D Engineer, Intel

Yuandong Guo, SI Engineer, Cruise

Chang Hsien, Principle Electrical Engineer, Dell EMC

Di Hu, Sr. Manager, Electrical Engineering, Cruise

Yifan Huang, Sr. Signal and Power Integrity Manager, AMD

Licheng (Joshua), Hardware Systems Engineer, NXP Semiconductors

Bonnie Lam, Sr. Electrical Engineer, Microsoft

Chaofeng Li, PhD Student, EMC Lab, Missouri University of Science and Technology

Jun Liao, Principle Engineer, Intel

Sinan Liu, Signal & Power Integrity Engineer, Meta

Wei Liu, Signal & Power Integrity Engineer, Intel

Abishek Manian, Analog Design Manager & Senior Member of Technical Staff, Texas Instruments

Shubhankar Marathe, Sr. ESD System Design Engineer, Amazon Lab126

Christian Naumann, Signal Integrity Engineer/ Power Engineer, Cisco Systems

Scotty Neally, PMTS Analog Design Engineer, AMD

Deepak Pai, RF Desense Engineer, Meta Platforms

Justin Patterson, DSP Software Engineer, Tektronix

Guilherme Paulino, System Engineer, Lumentum

Kyle Sammon, Staff System Architect, TE Connectivity

Greylan Smoak, Signal Integrity Engineer, Samtec

Tim Wang Lee, Signal Integrity Application Scientist, Keysight Technologies

Tao Wang, Sr. EMC Engineer, Amazon

Scott Witcher, Signal/Power Integrity Engineer, Chipletz

Yang Xu, EMC Engineer, Cruise

Ming Yang, Systems Engineer, Alphawave SEMI/University of Toronto

Guanshun Yu, Staff ASIC Design Engineer, Qualcomm